In Hong Kong, Intel showed off its WiMax Connection 2300 chipset, which it embedded in a Intel Centrino Duo-based computer with WiMax, WiFi and high-speed downlink packet access (HSDPA) 3G capabilities. The silicon, according the company, can extend the range and capacity of wireless networks. DataComm President Ira Brodsky lauded Intel’s move to combine WiMax with WiFi and other wireless technologies, which could benefit users wanting more multimedia content like mobile TV.
Via [technewsworld.com]
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