Category Archives: Chipsets

Intel Lines Up Santa Rosa, WiMax For Notebooks

Intel unveiled a new generation of its Centrino notebook technology as well as the ultramobile PC during afternoon keynote speeches at the Intel Developer Forum on Tuesday. Via []Continue Reading

Chip Companies Argue Over Next-Gen Wi-Fi

The simmering spat between Airgo Networks and Broadcom erupted into the open at the Globalpress Summit Conference in Monterey yesterday. Via []Continue Reading

Texas Instruments Announces WiMax Portfolio

This week, Texas Instruments made a series of announcements regarding its portfolio of WiMax chips. In addition to collaborations with ArrayComm and Mercury Computer Systems on the development of WiMax products, the company introduced a new line of digital and analog solutions for WiMax applications. Via []Continue Reading

IBM’s WPAN Chipset Aims To Replace High-Def Cables, Bluetooth

The breakthrough bipolar CMOS (BiCMOS) chip announced today by IBM at the International Solid State Circuits Conference may be exactly what the IEEE had in mind when it convened task force 802.15.3c in March of last year. But the chip that would make it possible for high-definition CE devices to stream content between each otherContinue Reading

Fabless Firms Team Up On WiMAX Platform

A silicon collaboration between fabless firms picoChip and Wintegra has resulted in a wireless system development platform for WiMAX basestations. Via []Continue Reading

Kit Allows Wireless Video Integration

Texas Instruments defines its DaVinci technology as “a collection of DSP-based system solution components tailored for efficient and compelling digital video.” Which is great, if consumer electronics (CE) products using it can easily connect to a source for that video. TI’s plan to help with that is to make it easier for manufacturers to stickContinue Reading

iPod Chip Builder Teams For Wireless And 3G Capabilities

PortalPlayer, the company best known for making processors for iPods, has announced two new technology partnerships. Via []Continue Reading

Cell Phones To Make Wi-Fi Calls

Chipmaker Royal Philips Electronics confirmed that a U.S. cellular carrier will launch voice-over-Wi-Fi technology this year, based on Philips’ new Nexperia 6120 chipset. Callers should be able to make calls on their home Wi-Fi networks for “a couple of bucks a month, flat rate,” according to Philips’ Carsten Schimanke. Via []Continue Reading

IBM To Unveil 10-Times-Faster Wi-Fi Chip

IBM plans to announce today that it has created a prototype chip that can enable wireless networking at 10 times the speed of today’s standard WiFi chips. Via []Continue Reading

Kyocera, Marvell Team On Wi-Fi/CDMA Platform

Kyocera Wireless Corp. has signed a strategic alliance with Marvell to develop a dual-mode Wi-Fi/CDMA handset platform. Via []Continue Reading

Chip Sets Roll Early For 802.11n

Eyebrows shot up recently when Broadcom Corp. announced sampling of an Intensi-fi chip set for 802.11n. Analysts were again taken aback three days later, when Atheros Communications Inc. announced its XSpan AR5008 family for the same standard. Via []Continue Reading

TI Completes $200M ZigBee Acqusition

Texas Instruments Inc. has added a ZigBee play to its portfolio of high performance analog chips with the completion of its acquisition of Chipcon. Via []Continue Reading

Atheros Moves On 802.11n

Atheros Communications Inc. today announced the launch of its XSPAN family of wireless LAN technologies for 802.11n, based on a triple-radio RF design. Via []Continue Reading

Two Vendors Claim ‘First’ Pre-Standard 802.11n Chipsets

Marvel and Broadcom both say they’re ready to ship chipsets based on the new technology, designed to increase bandwidth and make other improvements over 802.11g. Via []Continue Reading

IBM Makes Fast Wireless Chips

Using silicon germanium technology allows a high level of integration in the chips, according to IBM. Antennas can be embedded directly into the chipset, helping to reduce system costs. For example, a silicon germanium-based chipset, including receiver, transmitter and two antennas, would occupy the area of a dime, IBM says. Via []Continue Reading